Method for metalizing holes in insulation material

Details Method for metalizing holes in insulation material Method for metalizing holes in insulation material

1977-02-15

1980-01-15

Esposito, Michael F.

Metal working

Method of mechanical manufacture

Electrical device making

427 11, 427 97, 427123, 427181, 427191, 427264, 427275, 427290, 427357, 427367, 427369, B41M 308, H05K 300

Patent

active

041831373

ABSTRACT:
A method for metalizing the surface walls of a printed circuit board through hole to produce an electrically conductive path from one metallic layer of the board through the insulating plate to another metallic layer. A drill bit is forced through the board and into a block of soft conductor material. While the bit is turning the conductive cuttings from the block are carried to the hole in the insulating plate and smeared on the wall surface by the bit. The smeared conductive material creates an electrically conductive path between two metallic layers of the printed circuit board.

REFERENCES:
patent: 3158503 (1964-11-01), Young
patent: 3268653 (1966-08-01), McNutt
patent: 3357856 (1967-12-01), Ragan et al.
patent: 3391455 (1968-07-01), Hirohata et al.
patent: 3416958 (1968-12-01), Oxford
patent: 3562009 (1971-02-01), Cranston et al.
patent: 3576669 (1971-04-01), Filip

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