Method for metal oxide thin film deposition via MOCVD

Coating processes – Coating by vapor – gas – or smoke – Mixture of vapors or gases utilized

Reexamination Certificate

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C427S255330, C427S255350, C427S255360

Reexamination Certificate

active

06887523

ABSTRACT:
An MOCVD process is provided for forming metal-containing films having the general formula M′xM″(1−x)MyOz, wherein M′ is a metal selected from the group consisting of La, Ce, Pr, Nd, Pm, Sm, Y, Sc, Yb, Lu, and Gd; M″ is a metal selected from the group consisting of Mg, Ca, Sr, Ba, Pb, Zn, and Cd; M is a metal selected from the group consisting of Mn, Ce, V, Fe, Co, Nb, Ta, Cr, Mo, W, Zr, Hf and Ni; x has a value from 0 to 1; y has a value of 0, 1 or 2; and z has an integer value of 1 through 7. The MOCVD process uses precursors selected from alkoxide precursors, β-diketonate precursors, and metal carbonyl precursors in combination to produce metal-containing films, including resistive memory materials.

REFERENCES:
patent: 5204313 (1993-04-01), Lelental et al.
patent: 6120912 (2000-09-01), Sawada et al.
patent: 6204139 (2001-03-01), Liu et al.
patent: 6444264 (2002-09-01), Hintermaier et al.
Article entitled, “Reproducible switching effect in thin oxide films for memory applications,” by A. Beck et al. published in Applied Physics Letters on Jul. 3, 2000, vol. 7, No. 1 pp. 139-141.

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