Method for measuring the thickness of plate constructions and pi

Details Method for measuring the thickness of plate constructions and pi Method for measuring the thickness of plate constructions and pi

1997-08-26

1999-12-21

Oda, Christine K.

Measuring and testing

Vibration

By mechanical waves

702171, 73628, G01N 2926

Patent

active

060033770

ABSTRACT:
A method for automatic state control, inspection, cleaning and/or surface treatment of structures, especially measuring the thickness of plate constructions and pipes by means of ultrasound signals from a self-propelled, remotely controllable unit. The self-propelled unit is continuously moved in the measurement area, and a transmitter transmits an ultrasound signal in a direction substantially perpendicular to the surface of the construction. A reflected signal is received by a receiver which determines thickness and material quality of the construction at the measurement spot, on the basis of the received reflected signal, and parameters such as transit time for the reflected signal. The self-propelled unit performs self-positioning by means of previously known spots on the construction. All received data regarding the waveform of the reflected signal is stored in a computer, and thickness and material quality are verified by comparing data for a received signal in one spot, with data for received signals in adjacent spots. The steps are repeated for collection of data in new measurement spots.

REFERENCES:
patent: 4212258 (1980-07-01), Collins
patent: 4441369 (1984-04-01), Lessard et al.
patent: 4596144 (1986-06-01), Panton et al.
patent: Re4596144 (1995-10-01), Panton et al.
patent: 4799177 (1989-01-01), Sarr
patent: 5047990 (1991-09-01), Gafos et al.

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