Thermal measuring and testing – Temperature measurement – In spaced noncontact relationship to specimen
Patent
1996-08-26
1998-09-01
Bennett, G. Bradley
Thermal measuring and testing
Temperature measurement
In spaced noncontact relationship to specimen
374126, G01J 500
Patent
active
058020993
ABSTRACT:
The heat energy in a reactor used to process substrates is controlled to allow a more accurate measurement of the substrate temperature. The method of substrate temperature measurement is applicable to any reactor geometry and any type of heat source. Further, the method does not affect the process and so the performance of the reactor is unaffected when the substrate temperature measurement method is utilized. At a first predetermined time t1 during the process cycle, power to the heat source is turned off. At a second predetermined time t2, i.e., at the end of a time interval after the power is turned off, the heat energy from the reactor is measured for a predefined time interval, i.e., from second predetermined time t2 to a third predetermined time t3. After the measurement, i.e., at a fourth predetermined time t4, the power to the heat source is turned-on again and the process cycle continues. The time window over which the power is turned-off, i.e., the time between the first and fourth predetermined times, is small relative to the heat cycle in the particular process. Consequently, the process is unaffected by the brief interruption in heating. However, during the brief interruption, the only contribution to the heat energy in the reactor is from the substrate and other black body radiation.
REFERENCES:
patent: 4144758 (1979-03-01), Roney
patent: 4854727 (1989-08-01), Pecot et al.
patent: 4896281 (1990-01-01), Mack
patent: 5154512 (1992-10-01), Schietinger et al.
patent: 5213985 (1993-05-01), Sandroff et al.
patent: 5226732 (1993-07-01), Nakos et al.
patent: 5249142 (1993-09-01), Shirakawa et al.
patent: 5305417 (1994-04-01), Najm et al.
patent: 5442727 (1995-08-01), Fiory
patent: 5501637 (1996-03-01), Duncan et al.
Curran William J.
Moore Gary M.
Bennett G. Bradley
Gunnison Forrest E.
Moore Epitaxial Inc.
Suryadevara Omkar K.
LandOfFree
Method for measuring substrate temperature in radiant heated rea does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for measuring substrate temperature in radiant heated rea, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for measuring substrate temperature in radiant heated rea will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-277767