Method for measuring semiconductor constituent element...

Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S014000, C356S937000

Reexamination Certificate

active

06858454

ABSTRACT:
A method for measuring semiconductor constituent element content utilizes the steps of: obtaining a film thickness of an SiGeC layer formed on a semiconductor substrate by evaluation using spectroscopic ellipsometry; measuring infrared absorption spectrum of the SiGeC layer; and obtaining a C content of the SiGeC layer based on the film thickness and the infrared absorption spectrum of the SiGeC layer. The method: obtaining an apparent Ge content of the SiGeC layer by evaluation using spectroscopic ellipsometry; and obtaining an actual Ge content of the SiGeC layer based on the apparent Ge content and the C content. The constituent element content of the SiGeC layer can be easily and accurately measured according to the above-mentioned method.

REFERENCES:
patent: 6518572 (2003-02-01), Kishii et al.
patent: 20020106819 (2002-08-01), Nozawa et al.
patent: 20040014250 (2004-01-01), Peterson et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for measuring semiconductor constituent element... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for measuring semiconductor constituent element..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for measuring semiconductor constituent element... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3499695

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.