Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed
Patent
1998-05-22
2000-09-26
Bowers, Charles
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Electrical characteristic sensed
H01L 2100
Patent
active
061241407
ABSTRACT:
A method and apparatus for measuring the dimensions of features on the surface of a semiconductor device. The method may include passing a first electron beam having a first depth of focus over the semiconductor device and passing a second electron beam having a second depth of focus over the device. Electrical signals generated by the two electron beams may be analyzed singly or in combination to determine the lateral or vertical dimensions of the features at one or more positions relative to the surface of the semiconductor device. In one embodiment, the first and second electron beams are generated sequentially from a single electron gun. In another embodiment, the first and second electron beams are generated sequentially or simultaneously by either two separate electron guns or a single electron gun positioned proximate to two separate electron beam ports.
REFERENCES:
patent: 5512746 (1996-04-01), Saito
Fuse et al., "Focusing Optical System for Dual-Beam Laser Cutting and Welding," Sumitomo Electric Technical Review, 42: 87-93, 1996 (abstract only).
"The S-8000 Series CD-Measurement SEM and Applications," Hitachi Scientific Instrument Technical Data--SEM, No. 67, front cover, p. 2, back cover, 1995.
Do Douglas D.
Johnson Jeff C.
Bowers Charles
Micro)n Technology, Inc.
Thompson Craig
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