Method for measuring an adhesive strength of a multi-layer mater

Details Method for measuring an adhesive strength of a multi-layer mater Method for measuring an adhesive strength of a multi-layer mater

1983-04-08

1985-02-26

Swisher, S. Clement

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

73856, G01N 1904

Patent

active

045011540

ABSTRACT:
A method for measuring an adhesive strength of a multi-layer material having at least two layers, such as a plain bearing, which method includes the steps of placing a mold on one surface of the multi-layer material, casting a brazing metal into the mold to form and secure a resulting cast structure to the one surface of the multi-layer material such that the cast structure includes a first column portion connected to and extending substantially upright from the one surface of the multi-layer, an intermediate portion extending and diverging in diameter from the upper end of the first column portion and a second column portion extending from the upper end of the intermediate portion, causing the opposite chucks of a tension tester to grasp the second column portion and the multi-layer material or a holder connected to the multi-layer material, respectively, and applying a tensile force to the respective layers of the multi-layer material in a direction transverse to the one surface of said multi-layer material.

REFERENCES:
patent: 3527093 (1970-09-01), Sellers
patent: 4346602 (1982-08-01), Gould et al.
R. P. Anjard, "Thick Film Conductor Adhesion Testing", Microelectronics and Reliability, v. 10, (1971), pp. 269-275.
K. L. Mittal, "Adhesion Measurement of Thin Films," Electrocomponent Science and Technology, v. 3, No. 1, (Jun. 1976), pp. 21-42.

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