Method for measurement of a device under test

Details Method for measurement of a device under test Method for measurement of a device under test

2007-06-19

2009-08-11

Nguyen, Vinh P (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C324S758010

Reexamination Certificate

active

07573283

ABSTRACT:
A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.

REFERENCES:
patent: 5410259 (1995-04-01), Fujihara et al.
patent: 5436571 (1995-07-01), Karasawa
patent: 5773987 (1998-06-01), Montoya
patent: 6198299 (2001-03-01), Hollman
patent: 6707310 (2004-03-01), Takekoshi

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