Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1991-10-11
1994-01-11
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 96, C23C 2600
Patent
active
052779297
ABSTRACT:
A method for masking through-holes during the manufacture of a printed circuit board comprises providing a substrate having a plurality of through-holes. A removable masking seal comprised of a soluble material, a light-setting material or a thermo-setting material is formed on the surface of the substrate to cover at least one of the through-holes. At least one of the through-holes that is not covered with the masking seal is filled with a filler material by a conventional silk screen process. The masking seal is then removed, either by dissolving the masking seal in the case of the soluble material, or in the case of the light-setting or thermo-setting material, the masking seal is set by applying light or heat to reduce adhesion between the masking seal and the substrate, and then the set masking seal is peeled off to expose the through-hole.
REFERENCES:
patent: 3464855 (1969-09-01), Shaheen
patent: 3725215 (1973-04-01), Uchytil
patent: 4088545 (1978-05-01), Supnet
patent: 4312897 (1982-01-01), Reimann
patent: 4615781 (1986-10-01), Boudreau
patent: 4728568 (1988-03-01), Sasada
Kubo Isamu
Otani Yasuaki
Seki Kameharu
Adams Bruce L.
Beck Shrive
Dang Vi Duong
Nippon CMK Corp.
Wilks Van C.
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