Method for masking a workpiece and a vacuum treatment facility

Details Method for masking a workpiece and a vacuum treatment facility Method for masking a workpiece and a vacuum treatment facility

1995-02-01

1997-09-02

Breneman, R. Bruce

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429811, 20429815, 20429823, 20429826, 20429827, 20429828, 20429829, 156345, 118719, 118721, 118504, 118505, 414217, 414222, C23C 1456, C23C 1604, C23F 102

Patent

active

056627858

ABSTRACT:
A vacuum treatment facility and method are provided for the surface treatment of workpieces, particularly for the covering of the central and/or peripheral area of circular-disk-shaped workpieces, as in the manufacturing of CD's or storage plates. The facility comprises a chamber arrangement that can be evacuated, and transport devices in order to transport the workpieces into, through and out of the chamber arrangement. Along the transport devices, an application station is provided for applying at least one loose masking element respectively to one workpiece respectively. The method is a method for masking a workpiece, particularly for covering the central and/or peripheral area of circular-disk-shaped workpieces, as in the manufacturing of storage plates, during a vacuum surface treatment. At least one masking element is applied as a separate part to the workpiece on its path to the treatment and is subsequently removed therefrom again.

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patent: 5135635 (1992-08-01), Ikeda
patent: 5245736 (1993-09-01), Schertler

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