Method for marking workpieces

Details Method for marking workpieces Method for marking workpieces

1998-07-22

1999-12-07

Kim, Robert H.

Optics: measuring and testing

Angle measuring or angular axial alignment

356143, 356144, 356146, 356401, G01B 1126

Patent

active

059992522

ABSTRACT:
A method for laser marking semiconductor wafers wherein marking errors attributable to the laser marking tool are measured for each of the anticipated marking fields. A weighted average error is then calculated, and a correction based thereon is entered into the control mechanism of the laser marking tool. The method of the invention reduces downtime between jobs by eliminating the need to recalibrate the laser marking tool between jobs.

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