Method for marking functional integrated circuit chips with unde

Metal working – Method of mechanical manufacture – Electrical device making

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29417, 29840, 29841, H05K 330

Patent

active

059183632

ABSTRACT:
A method for selectively marking integrated circuit chips (205, 210) formed on a wafer (200) includes the steps of testing the integrated circuit chips (205, 210)) of the wafer (200) to determine whether the integrated circuit chips (205, 210) are functional, dispensing underfill material (215) only on functional integrated circuit chips (205), and separating, subsequent to the dispensing step, the wafer (200) into individual integrated circuit chips (205, 210). The functional integrated circuit chips (205) are marked with the underfill material (215), while nonfunctional integrated circuit chips (210) are not marked with the underfill material (215).

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HYSOL.RTM. FP4510* Flip Chip Encapsulant Preliminary Bulletin, Dexter Electronics Materials Division, Aug. 1991.

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