Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-05-20
1999-07-06
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
29417, 29840, 29841, H05K 330
Patent
active
059183632
ABSTRACT:
A method for selectively marking integrated circuit chips (205, 210) formed on a wafer (200) includes the steps of testing the integrated circuit chips (205, 210)) of the wafer (200) to determine whether the integrated circuit chips (205, 210) are functional, dispensing underfill material (215) only on functional integrated circuit chips (205), and separating, subsequent to the dispensing step, the wafer (200) into individual integrated circuit chips (205, 210). The functional integrated circuit chips (205) are marked with the underfill material (215), while nonfunctional integrated circuit chips (210) are not marked with the underfill material (215).
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George Reed Allen
Juskey Frank Joseph
Mangold Richard Lee
Lamb James A.
Motorola Inc.
Vereene Kevin G.
Vo Peter
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