Method for manufacturing wiring substrate

Details Method for manufacturing wiring substrate Method for manufacturing wiring substrate

2007-12-11

2007-12-11

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S847000, C205S167000, C427S097400, C427S099100, C430S016000

Reexamination Certificate

active

11091891

ABSTRACT:
A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate; (b) irradiating light energy to remove the reactive groups from the ground layer precursor to thereby form a ground layer charged in cathode; (c) patterning a cationic surface-active agent of anode to be left on the first area of the substrate with the ground layer as a ground; (d) providing a catalyst at the surface-active agent; and (e) forming a wiring along the first area of the substrate by precipitating a metal layer to the catalyst.

REFERENCES:
patent: 3684572 (1972-08-01), Taylor
patent: 5079600 (1992-01-01), Schnur et al.
patent: 5510216 (1996-04-01), Calabrese et al.
patent: 5684065 (1997-11-01), Hiraoka et al.
patent: 07-263841 (1995-10-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing wiring substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing wiring substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing wiring substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3867956