Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1997-01-28
1999-10-19
Dudash, Diana
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427123, 427125, 430312, 430313, 430315, B05D 512
Patent
active
059685891
ABSTRACT:
A wiring pattern is selectively formed on a base member by permanent resist. Furthermore, the thickness of a non-electrolytic copper plating layer is made thinner than that of a permanent resist layer on the base member, so that a concave shape is formed in combination with the permanent resist layer. A solder resist layer is formed on the non-electrolytic copper plating layer and the permanent resist layer except for a pad portion formed by the non-electrolytic copper plating layer, and a peripheral portion of the pad portion is surrounded by a wall formed by the permanent resist layer and the solder resist layer. Solder is supplied onto the pad portion surrounded by the wall by way of either the MICROPRESS method or the MICROBALL method.
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Dudash Diana
NEC Corporation
Strain Paul D.
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