Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2005-12-20
2005-12-20
Lam, Cathy F. (Department: 1775)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S258000, C174S261000, C174S264000
Reexamination Certificate
active
06977349
ABSTRACT:
Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask7is formed on a bump-forming surface3aof a metal foil3which has a thickness that is the sum of the thickness t1of the wiring circuit1and the height t2of the bumps2which are to be formed on the wiring circuit1(t1+t2), and then the bumps2are formed by half-etching the metal foil3to a depth corresponding to the desired bump height t2from the bump-formation etching mask7side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.
REFERENCES:
patent: 3217089 (1965-11-01), Beck
patent: 5759417 (1998-06-01), Inaba
patent: 6222136 (2001-04-01), Appelt et al.
patent: 6365499 (2002-04-01), Nakamura et al.
patent: 6518510 (2003-02-01), Kaneda et al.
patent: 6800816 (2004-10-01), Kaneda
Kaneda Yutaka
Naito Keiichi
Shinohara Toshihiro
Lam Cathy F.
Sony Chemicals Corp.
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