Method for manufacturing wiring board

Details Method for manufacturing wiring board Method for manufacturing wiring board

2007-10-23

2007-10-23

Kim, Paul D. (Department: 3729)

Metal working

Electric condenser making

C029S592100, C029S832000, C029S842000, C029S847000, C029S852000, C216S063000, C219S121710, C257S306000, C257S310000, C257S528000, C257S532000, C361S301100, C361S302000, C361S301400, C361S309000, C361S311000, C438S239000, C438S386000, C438S393000

Reexamination Certificate

active

11253942

ABSTRACT:
A method for manufacturing a wiring board, comprising the steps of: forming a first electrode layer having first and second opening portions, forming a dielectric layer formed on the first electrode layer and having third and fourth opening portions, forming a second electrode layer formed on the dielectric layer and having fifth and sixth opening portions, wherein the first electrode layer, the dielectric layer, and the second electrode layer form a capacitor; forming an insulating layer inside a first opening defined by the first, third, and fifth opening portions, and a second opening defined by the second, fourth, and sixth opening portions; using a laser beam having a processing diameter to form first and second via holes extending through the insulating layer formed inside the first and second openings, respectively; and forming first and second via wiring portions in the first and second via holes, respectively.

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