Method for manufacturing wafers

Details Method for manufacturing wafers Method for manufacturing wafers

1981-04-27

1982-10-05

Jones, Raymond N.

Food or edible material: processes, compositions, and products

Processes

Treatment or preparation of farinaceous dough, batter, or...

426502, 426506, 426517, 426518, 426560, A21D 1300

Patent

active

043528317

ABSTRACT:
Wafers are produced by guiding a sheet of bread having friable outer crusts and a relatively soft center through wafer forming apparatus. The apparatus includes a pair of rolls, one of said rolls, i.e., a cutting roll having one or more wafer forming recesses or cavities therein and the other roll being a pressure roll which operates in rolling engagement with the cutting roll. As the sheet of bread is introduced into the nip formed between the two rolls the pressure roll acts to press the bread into the cavity or cavities on the cutting roll and into engagement with the edges of the cavity or cavities to cut wafers from the sheet of bread. Each cavity is configured to have a bottom surface which rises as a gradually tapering wall to a cutting edge which is coterminous with the surface of the cutting roll. Continuous production of wafers is possible with the edges of the wafers being sharply defined, free of undesirable crumbling and devoid of fracture lines.

REFERENCES:
patent: 2589908 (1952-03-01), Weidenmiller
patent: 2614511 (1952-10-01), Neutelings
patent: 3937852 (1976-02-01), Wolf

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