Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1985-10-02
1987-04-21
Roy, Upendra
Metal working
Method of mechanical manufacture
Assembling or joining
29576B, 29578, 148 15, 148187, 148DIG82, 148DIG140, 156643, 357 42, 357 91, H01L 21265, H01L 21308
Patent
active
046584960
ABSTRACT:
A method for manufacturing VLSI MOS-transistor circuits involving the production of transistors by means of a spacer layer technique and ohmic contacts from the gate interconnect to the diffused regions of the substrate (thus providing buried contacts) both being simultaneously generated. Contact holes are provided at the desired location in the substrate before the deposition of the spacer layer occurs across the surface of the substrate. The spacer layer is simultaneously structured at the side walls of the gates and at the side walls of the interconnects which serve as connections. The contact hole region is doped at the same time as the source/drain areas are provided by ion implantation. The combined manufacture of transistors using spacer technology and buried contacts makes it possible to manufacture MOS logic circuits and memory circuits with voltage stable transistors in high packing density.
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Beinvogl Willy
Enders Gerhard
Mohr Ernst-Guenter
Roy Upendra
Siemens Aktiengesellschaft
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