Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-09-18
2008-10-28
Picardat, Kevin M (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S025000, C438S027000
Reexamination Certificate
active
07442565
ABSTRACT:
A method for manufacturing a vertical light emitting diode of the invention allows an easier process of individually separating chips. A light emitting structure is formed on a growth substrate having a plurality of device areas and at least one device isolation area. The light emitting structure has an n-type clad layer, an active layer and a p-type clad layer sequentially formed therein. Corresponding p-type electrodes are formed on the light emitting structure on the device areas. A glass substrate having through holes perforated therein is provided on the p-electrodes so that the through holes are disposed corresponding to the p-electrodes. Also, the through holes are plated with a metal material to form patterns of a plating layer on the p-electrodes. Then, the growth substrate is removed to form n-electrodes on the n-type clad layer. The glass substrate is removed via etching.
REFERENCES:
patent: 6071795 (2000-06-01), Cheung et al.
patent: 6930327 (2005-08-01), Maeda et al.
patent: 7172945 (2007-02-01), Shioga et al.
patent: 2004/0079951 (2004-04-01), Horng et al.
patent: 2005/0017253 (2005-01-01), Hata
patent: 2005/0095734 (2005-05-01), Hasebe et al.
patent: 100 51 465 (2002-05-01), None
patent: 10-0495215 (2005-06-01), None
German Office Action, with English Translation, issued in corresponding German Patent Application No. DE 10 2006 043 843.4-33, issued on Nov. 16, 2007.
Hwang Hae Youn
Ryu Yung Ho
McDermott Will & Emery LLP
Picardat Kevin M
Samsung Electro-Mechanics Co. Ltd.
LandOfFree
Method for manufacturing vertical structure light emitting... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing vertical structure light emitting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing vertical structure light emitting... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4013038