Data processing: financial – business practice – management – or co – Automated electrical financial or business practice or...
Reexamination Certificate
2006-08-15
2006-08-15
Eddy, Elisca Pierre (Department: 3621)
Data processing: financial, business practice, management, or co
Automated electrical financial or business practice or...
C257S666000, C257S473000, C257S669000, C257S675000, C257S700000
Reexamination Certificate
active
07092890
ABSTRACT:
A thin GaAs Substrate can be provided with a copper back-metal layer to allow the GaAs Substrate to be packaged using conventional plastic packaging technologies. By providing the GaAs Substrate with a copper back-metal layer, the GaAs Substrate can be made thinner than 2 mils (about 50 microns), thereby reducing heat dissipation problems and allowing the semiconductor die to be compatible with soft-solder technologies. By enabling the semiconductor die to be packaged in a plastic package substantial cost savings can be achieved.
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Crowder Jeffrey D.
Elliott Alexander J.
Miller Monte G.
Eddy Elisca Pierre
Freescale Semiconductor Inc.
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