Method for manufacturing thin film device and semiconductor...

Details Method for manufacturing thin film device and semiconductor... Method for manufacturing thin film device and semiconductor...

2005-07-12

2005-07-12

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Having organic semiconductive component

C438S082000, C257S040000

Reexamination Certificate

active

06916681

ABSTRACT:
The present invention relates to a method for manufacturing a thin film device. The thin film device is manufactured by bonding a second substrate (106) to a thin film device layer (103) provided on a protective layer (102) formed on a first substrate (101) through a first adhesive layer (105), then, completely or partly removing the first substrate (101) in accordance with a process including at least one process of a chemical process and a mechanical polishing process, bonding a third substrate (109) to the exposed protective layer (102) or the protective layer (102) covered with the partly removed first substrate (101) through a second adhesive layer (108) and separating or removing the second substrate (106). Thus, the thin film device suitable for a light and thin display panel is manufactured without deteriorating a ruggedness.

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