Method for manufacturing thick film circuit board device

Details Method for manufacturing thick film circuit board device Method for manufacturing thick film circuit board device

1989-03-06

1991-02-12

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29829, 29832, 29840, 29846, 427 8, 118713, 738659, H01L 1706

Patent

active

049912844

ABSTRACT:
A method of manufacturing and monitoring the manufacture of a thick film circuit board device. The method includes the steps of forming a resistive layer in a prescribed pattern on an insulative base board, forming a first conductive layer on the insulative base board adjacent to the resistive layer with a gap of predetermined width therebetween and forming a second conductive layer in the gap and overlapping a portion of the resistive layer and the first conductive layer for establishing electrical contact between the resistive layer and the first conductive layer.

REFERENCES:
patent: 4724040 (1988-02-01), Iwasa
patent: 4735676 (1988-04-01), Iwasa
patent: 4830878 (1989-05-01), Kaneko et al.
patent: 4835038 (1989-05-01), Kaneko et al.

Affiliated with

Also associated with

Rating

Method for manufacturing thick film circuit board device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing thick film circuit board device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing thick film circuit board device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-11972