Method for manufacturing thermoplastic resin molded semiconducto

Details Method for manufacturing thermoplastic resin molded semiconducto Method for manufacturing thermoplastic resin molded semiconducto

1994-10-24

1996-10-08

Fourson, George

Fishing, trapping, and vermin destroying

437214, 437219, 29 2501, 26427217, H01L 2156, H01L 2158

Patent

active

055631037

ABSTRACT:
A semiconductor assembly is sandwiched by two metal molds so that the semiconductor assembly is located within a cavity formed between the metal molds. Thermoplastic resin is injected through an injection stream passage provided in one of the metal molds and directly leading to the cavity therein. Resin in the injection stream passage within one of the metal molds is heated to a temperature higher than a melting point of the themoplastic resin. The thermoplastic resin injected into the cavity is cooled by the metal molds to be hardened.

REFERENCES:
patent: 5059373 (1991-10-01), Hirabayashi

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