Method for manufacturing thermal interface material with...

Details Method for manufacturing thermal interface material with... Method for manufacturing thermal interface material with...

2006-11-03

2009-08-04

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S077000, C257SE23011, C977S712000

Reexamination Certificate

active

07569425

ABSTRACT:
A method for manufacturing a thermal interface material includes the steps of: (a) forming an array of carbon nanotubes on a substrate; (b) submerging the carbon nanotubes in a liquid macromolecular material; (c) solidifying the liquid macromolecular material; and (d) cutting the solidified liquid macromolecular material, to obtain the thermal interface material with the carbon nanotubes secured therein.

REFERENCES:
patent: 6350488 (2002-02-01), Lee
patent: 6407922 (2002-06-01), Eckblad
patent: 2003/0117770 (2003-06-01), Montgomery et al.
patent: 2004/0097635 (2004-05-01), Fan
patent: 200427961 (2004-12-01), None
Sa Vas Berber, Young-Kyun Kwon, and David Tomanek; Unusually High Thermal Conductivity of Carbon Nanotubes; p. 4613, vol. 84, Physical Review Letters 2000.
Shoushan Fan, Michael G. Chapline, Nathan R. Franklin, Thomas W. Tombler, Alan M. Cassell, and Hongjie Dai; Self-Oriented Regular Arrays of Carbon Nanotubes and Their Field Emission Properties; pp. 512-514, vol. 283, Science 1999.
Liang Liu and Shoushan Fan; Isotope Labeling of Carbon Nanotubes and Formation 12C-13C Nanotubes Junctions; pp. 11502-11503, vol. 123, J. Am. Chem. Soc. 2001.

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