Method for manufacturing surface acoustic wave device

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal

Reexamination Certificate

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Details

C438S050000, C257S416000, C257SE21503, C257SE21499, C310S31300R

Reexamination Certificate

active

10559238

ABSTRACT:
To provide a high quality SAW device with enhanced productivity, wherein an outer face of a SAW chip mounted on a mounting substrate is covered with a heat-softened resin sheet and resin is filled on the SAW chip to form an airtight space below an IDT in the SAW device. A method for manufacturing the SAW device includes: a step of flip-chip mounting the SAW chip on the mounting substrate, a step of placing the resin sheet on an upper face of the SAW chip; a laminating step of setting ambient environment to pressure-reduced or vacuum atmosphere and covering the outer face of the SAW chip with resin while securing the airtight space by pressurizing the resin sheet while heating the resin sheet; a press forming step of curing the resin while maintaining the airtight space by maintaining pressurized and heated state in the laminating step; and a post-curing step of performing heating at a temperature and for a time in which the resin completely cures, wherein a thickness tr of the resin sheet before the laminating step satisfies an equation ofin-line-formulae description="In-line Formulae" end="lead"?L/{(X+Gx)(Y+Gy)}≦tr.in-line-formulae description="In-line Formulae" end="tail"?

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