Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate
2007-02-27
2007-02-27
Tran, Long (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
C438S050000, C257S416000, C257SE21503, C257SE21499, C310S31300R
Reexamination Certificate
active
10559238
ABSTRACT:
To provide a high quality SAW device with enhanced productivity, wherein an outer face of a SAW chip mounted on a mounting substrate is covered with a heat-softened resin sheet and resin is filled on the SAW chip to form an airtight space below an IDT in the SAW device. A method for manufacturing the SAW device includes: a step of flip-chip mounting the SAW chip on the mounting substrate, a step of placing the resin sheet on an upper face of the SAW chip; a laminating step of setting ambient environment to pressure-reduced or vacuum atmosphere and covering the outer face of the SAW chip with resin while securing the airtight space by pressurizing the resin sheet while heating the resin sheet; a press forming step of curing the resin while maintaining the airtight space by maintaining pressurized and heated state in the laminating step; and a post-curing step of performing heating at a temperature and for a time in which the resin completely cures, wherein a thickness tr of the resin sheet before the laminating step satisfies an equation ofin-line-formulae description="In-line Formulae" end="lead"?L/{(X+Gx)(Y+Gy)}≦tr.in-line-formulae description="In-line Formulae" end="tail"?
REFERENCES:
patent: 6543109 (2003-04-01), Taga
patent: 6670206 (2003-12-01), Kim et al.
patent: 2003/0164529 (2003-09-01), Inoue et al.
patent: 2004/0239449 (2004-12-01), Stelzl et al.
patent: 2006/0053607 (2006-03-01), Onozawa
patent: 06-093427 (1994-04-01), None
patent: 10-022763 (1998-01-01), None
patent: 10-215142 (1998-08-01), None
patent: 10-321666 (1998-12-01), None
patent: 2002-151531 (2002-05-01), None
patent: 2002-184884 (2002-06-01), None
patent: 2002-217219 (2002-08-01), None
patent: 2002-217220 (2002-08-01), None
patent: 2002-314234 (2002-10-01), None
patent: 2002-334954 (2002-11-01), None
patent: 2003-017979 (2003-01-01), None
patent: 2003-032061 (2003-01-01), None
patent: 2003-158436 (2003-05-01), None
Anzai Tatsuya
Ogawa Yuji
Onozawa Yasuhide
Koda & Androlia
Toyo Communication Equipment Co., Ltd.
Tran Long
LandOfFree
Method for manufacturing surface acoustic wave device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing surface acoustic wave device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing surface acoustic wave device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3859830