Method for manufacturing surface acoustic wave device

Wave transmission lines and networks – Coupling networks – Electromechanical filter

Reexamination Certificate

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Details

C428S108000, C428S110000, C029S025350, C264S272110

Reexamination Certificate

active

11169292

ABSTRACT:
A plurality of surface acoustic wave elements, with an IDT electrode2and a pad electrode3formed on the principal surface of a piezoelectric substrate1, are formed to be flip-chip mounted on a circuit board5and sealed using sealing resin7. The circuit board5is diced integrally with the sealing resin7applying a rotating dicing blade8from the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin7.

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patent: 7154206 (2006-12-01), Shimada et al.
patent: 7180228 (2007-02-01), Masuko et al.
patent: 7183124 (2007-02-01), Onozawa
patent: 2004/0160750 (2004-08-01), Masuko
patent: 2004/0169444 (2004-09-01), Higuchi et al.
patent: 2000-216660 (2000-08-01), None
patent: 2002-100945 (2002-04-01), None
patent: 2003-110402 (2003-04-01), None
patent: 2004-072473 (2004-03-01), None
patent: 2004-248039 (2004-09-01), None

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