Method for manufacturing surface acoustic wave device

Details Method for manufacturing surface acoustic wave device Method for manufacturing surface acoustic wave device

2007-07-24

2007-07-24

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029S594000, C029S840000, C029S841000, C029S848000, C029S855000, C310S31300R

Reexamination Certificate

active

11220815

ABSTRACT:
A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin. When the above-configured acoustic wave device is applied for a frequency filter, a resonator, in a portable telephone unit, a keyless entry or the like communication apparatus, the overall size of such apparatus can be reduced and a higher reliability is implemented.

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International Search Report corresponding to application No. PCT/JP02/00949, dated Apr. 2, 2002.
English translation of Form PCT/ISA/210 for Cite No. 1 (form paragraphs—only).
English translation of Form PCT/ISA/210.

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