Method for manufacturing surface acoustic wave device

Details Method for manufacturing surface acoustic wave device Method for manufacturing surface acoustic wave device

2005-02-15

2005-02-15

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S745000

Reexamination Certificate

active

06855637

ABSTRACT:
Provided is a method of manufacturing surface acoustic wave (SAW) devices having a first conductive pattern and a second conductive pattern of different thicknesses on one piezoelectric substrate. Combination of a plurality of steps of forming metal films and etching steps allows accurate production of SAW devices having a plurality of electrodes of different thicknesses on one piezoelectric substrate.

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