Method for manufacturing substrate having built-in components

Details Method for manufacturing substrate having built-in components Method for manufacturing substrate having built-in components

2009-12-17

2011-12-06

Angwin, David (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S841000, C029S854000, C029S855000, C174S250000, C361S748000, C361S760000, C361S761000

Reexamination Certificate

active

08069558

ABSTRACT:
A method for manufacturing a substrate having built-in components prevents a short circuit caused by the spread of solder or conductive adhesive. Land regions to connect a circuit component and a wetting prevention region surrounding the land regions are formed on one primary surface of a metal foil. Terminal electrodes of the circuit component are electrically connected to the land regions using solder, and an uncured resin is disposed on and pressure bonded to the metal foil and the circuit component, so that a resin layer in which the circuit component is embedded is formed. Subsequently, a wiring pattern is formed by processing the metal foil. The wetting prevention region is a region obtained by roughening or oxidizing one primary surface of the metal foil so as to reduce solder wettability.

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