Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2008-04-08
2008-04-08
Hu, Shouxiang (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S026000, C438S029000, C438S034000
Reexamination Certificate
active
10959036
ABSTRACT:
A method for manufacturing a substrate conjugate is provided including a step of joining a first substrate including a first functional device to a second substrate including a second functional device and a step of providing a protective layer on at least one of: a face of the first substrate on which the first functional device is placed; and a face of the second substrate on which the second functional device is placed.
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Communicationfrom Japanese Patent Office regarding corresponding application.
Communication from Korean Patent Office regarding counterpart application.
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Communicationfrom Japanese Patent Office regarding corresponding application, 2006.
Communication from Korean Patent Office regarding counterpart application, 2006.
Communication from Japanese Patent Office regarding counterpart application, 2006.
Koeda Hiroshi
Makigaki Tomohiro
Harness & Dickey & Pierce P.L.C.
Hu Shouxiang
Seiko Epson Corporation
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