Method for manufacturing solid-state image pick-up device

Details Method for manufacturing solid-state image pick-up device Method for manufacturing solid-state image pick-up device

2011-03-01

2011-03-01

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S458000, C438S057000, C257SE21570

Reexamination Certificate

active

07897427

ABSTRACT:
There is provided a method for manufacturing a solid-state image device which includes the steps of: forming a silicon epitaxial growth layer on a silicon substrate; forming photoelectric conversion portions, transfer gates, and a peripheral circuit portion in and/or on the silicon epitaxial growth layer and further forming a wiring layer on the silicon epitaxial growth layer; forming a split layer in the silicon substrate at a side of the silicon epitaxial growth layer; forming a support substrate on the wiring layer; peeling the silicon substrate from the split layer so as to leave a silicon layer formed of a part of the silicon substrate at a side of the support substrate; and planarizing the surface of the silicon layer.

REFERENCES:
patent: 6277715 (2001-08-01), Takeno et al.
patent: 7582502 (2009-09-01), Hwang et al.
patent: 1612863 (2006-01-01), None
patent: 2007-013089 (2007-01-01), None
patent: 03/019667 (2003-03-01), None
patent: 2008/033508 (2008-03-01), None
European Search Report for European patent application No. 10000005.8, dated May 10, 2010.

Affiliated with

Also associated with

Rating

Method for manufacturing solid-state image pick-up device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing solid-state image pick-up device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing solid-state image pick-up device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2772001