Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor
Reexamination Certificate
2006-11-14
2006-11-14
Hiteshew, Felisa (Department: 1722)
Single-crystal, oriented-crystal, and epitaxy growth processes;
Forming from vapor or gaseous state
With decomposition of a precursor
C117S094000, C117S902000, C117S912000
Reexamination Certificate
active
07135074
ABSTRACT:
A method for manufacturing a silicon carbide single crystal includes the steps of: preparing a seed crystal with a screw dislocation generation region; and growing the single crystal on a growth surface of the seed crystal. The generation region occupies equal to or smaller than 50% of the growth surface, which has an offset angle equal to or smaller than 60 degrees. The screw dislocation density in the single crystal generated from the generation region is higher than that in the other region. The single crystal includes a flat C-surface facet disposed on a growing surface of the single crystal. The C-surface facet overlaps at least one of parts of the growing surface provided by projecting the generation region in a direction perpendicular to the growth surface and in a direction parallel to a <0001> axis, respectively.
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Official Communication and its translation from Japanese Patent Office dated Oct. 4, 2005.
Gunjishima Itaru
Hirose Fusao
Nakamura Daisuke
Sugiyama Naohiro
Denso Corporation
Hiteshew Felisa
Kabushiki Kaisha Toyota Chuo Kenkyusho
Posz Law Group , PLC
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