Method for manufacturing semiconductor sensor

Details Method for manufacturing semiconductor sensor Method for manufacturing semiconductor sensor

2008-06-05

2010-06-29

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Electrical characteristic sensed

C257S048000, C514S033000, C514S038000

Reexamination Certificate

active

07745235

ABSTRACT:
A semiconductor sensor is disclosed that includes a substrate including at least a semiconductor layer. The substrate includes a weight arranging part in the vicinity of the center of the substrate, a flexible part around the weight arranging part, and supporting parts provided around the flexible part. The semiconductor sensor further includes a weight arranged on the weight arranging part. The weight is made of a material different from that of the weight arranging part and the flexible parts.

REFERENCES:
patent: 4893509 (1990-01-01), MacIver et al.
patent: 5905044 (1999-05-01), Lee et al.
patent: 6629462 (2003-10-01), Otsuchi et al.
patent: 7367232 (2008-05-01), Vaganov et al.
patent: 2005/0160814 (2005-07-01), Vaganov et al.
patent: 52-36395 (1977-09-01), None
patent: 2-139216 (1990-05-01), None
patent: 3-115978 (1991-05-01), None
patent: 4-240792 (1992-08-01), None
patent: 5-322566 (1993-12-01), None
patent: 7-280829 (1995-10-01), None
patent: 8-7228 (1996-01-01), None
patent: 2004-87598 (2004-03-01), None
patent: 2004-111671 (2004-04-01), None
patent: 2004-245760 (2004-09-01), None
patent: 2004-273679 (2004-09-01), None
Mar. 28, 2006 official action in corresponding Japanese patent application.

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