Method for manufacturing semiconductor power modules with an ins

Details Method for manufacturing semiconductor power modules with an ins Method for manufacturing semiconductor power modules with an ins

1985-06-03

1987-10-20

Godici, Nicholas P.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 2281733, 228187, 228203, 228215, B23K 3102

Patent

active

047008792

ABSTRACT:
A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a first step; joining the semiconductor sandwiches and the carrier unit together with a low-melting solder in a second step; performing the first and second soldering steps without flux in a gas from the group consisting of hydrogen and forming gas; and preventing a mixture of the high-melting solder and the low-melting solder during the second step.

REFERENCES:
patent: 3150446 (1964-09-01), Todd
patent: 3339008 (1967-08-01), MacArthur et al.
patent: 3720999 (1973-03-01), Nier
patent: 4270265 (1981-06-01), Ikeda et al.
patent: 4389771 (1983-06-01), Cassidy et al.
patent: 4409278 (1983-10-01), Jochym

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