Method for manufacturing semiconductor package having...

Details Method for manufacturing semiconductor package having... Method for manufacturing semiconductor package having...

2006-06-27

2006-06-27

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S734000, C257S735000, C257S736000

Reexamination Certificate

active

07067353

ABSTRACT:
A method for manufacturing a semiconductor package, the method including the steps of attaching a bottom surface of a semiconductor wafer to a first supporting member, forming a through hole in the semiconductor wafer, separating the semiconductor wafer from the first supporting member, forming an insulating layer on at least the bottom surface of the semiconductor wafer and the inner wall of the through hole, forming a conducting layer underneath the semiconductor wafer, the conducting layer spanning at least the bottom of the through hole; and forming a conductive member in the through hole and in electrical contact with the conducting layer.

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patent: 6225651 (2001-05-01), Billon
patent: 6294837 (2001-09-01), Akram et al.
patent: 6603190 (2003-08-01), Kosaki et al.
patent: 2002/0070429 (2002-06-01), Wester
patent: 2003/0011070 (2003-01-01), Iijima et al.
patent: 2003/0116857 (2003-06-01), Taniguchi et al.
patent: 10-223833 (1998-08-01), None

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