Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2011-02-01
2011-02-01
Richards, N. Drew (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
Reexamination Certificate
active
07879635
ABSTRACT:
A method for manufacturing a laser diode includes: providing a semiconductor structure in which semiconductor layers are laminated; forming a waveguide ridge in the layers; forming an SiO2film over the entire surface; forming a second resist pattern covering the SiO2film in channels adjacent the waveguide ridge such that top surfaces of the second resist pattern in the channels are higher than the top surface of a p-GaN layer in the waveguide ridge and lower than the top surface of the SiO2film on the top of the waveguide ridge, the second resist pattern exposing the top surface of the SiO2film on the top of the waveguide ridge; removing the SiO2film, using the second resist pattern as a mask, to expose the top surface of the p-GaN layer in the waveguide ridge; and forming an electrode layer on the top surface of the p-GaN layer.
REFERENCES:
patent: 4943970 (1990-07-01), Bradley
patent: 5008893 (1991-04-01), Amann et al.
patent: 5293392 (1994-03-01), Shieh et al.
patent: 5333141 (1994-07-01), Wolf et al.
patent: 5474954 (1995-12-01), Yang
patent: 5504768 (1996-04-01), Park et al.
patent: 6122414 (2000-09-01), Shimizu
patent: 6144682 (2000-11-01), Sun
patent: 6171876 (2001-01-01), Yuang et al.
patent: 6174747 (2001-01-01), Ho et al.
patent: 6222866 (2001-04-01), Seko
patent: 6278720 (2001-08-01), Lee et al.
patent: 6335215 (2002-01-01), Yuang
patent: 6335216 (2002-01-01), Yoshida et al.
patent: 6365429 (2002-04-01), Kneissl et al.
patent: 6744800 (2004-06-01), Kneissl et al.
patent: 6778751 (2004-08-01), Tada et al.
patent: 6852558 (2005-02-01), Lee et al.
patent: 6940885 (2005-09-01), Cheng et al.
patent: 6995406 (2006-02-01), Tojo et al.
patent: 7020173 (2006-03-01), Yamamoto et al.
patent: 7075962 (2006-07-01), Ryou et al.
patent: 7126977 (2006-10-01), Kaneko
patent: 7141441 (2006-11-01), Koyama et al.
patent: 7177336 (2007-02-01), Taneya et al.
patent: 7280712 (2007-10-01), Liu
patent: 7406111 (2008-07-01), Sung et al.
patent: 7433381 (2008-10-01), Wang et al.
patent: 7525123 (2009-04-01), Kotani
patent: 2002/0096494 (2002-07-01), Lu et al.
patent: 2006/0043409 (2006-03-01), Ohmi
patent: 2006/0078020 (2006-04-01), Izu et al.
patent: 2006/0172444 (2006-08-01), Jungnickel et al.
patent: 2000-022261 (2000-01-01), None
patent: 2000-340880 (2000-12-01), None
patent: 2003-142769 (2003-05-01), None
patent: 2005-347630 (2005-12-01), None
patent: 2006-93379 (2006-04-01), None
patent: WO 03/085790 (2003-10-01), None
Sakuma Hitoshi
Shiga Toshihiko
Lee Jae
Leydig , Voit & Mayer, Ltd.
Mitsubishi Electric Corporation
Richards N. Drew
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