Method for manufacturing semiconductor module

Details Method for manufacturing semiconductor module Method for manufacturing semiconductor module

2011-07-26

2011-07-26

Bryant, Kiesha R (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S126000, C438S127000, C257SE21499, C257SE21500, C257SE21501, C257SE21502, C257SE21503

Reexamination Certificate

active

07985630

ABSTRACT:
A method for manufacturing a semiconductor module, includes the steps of preparing a board; mounting a semiconductor device on the second metal foil; placing a resin case onto the board for surrounding a first metal foil, an insulating sheet, the second metal foil, and the semiconductor device; pouring a resin in a paste form into the case to fill a space relative to the first metal foil, insulating sheet, the second metal foil and the semiconductor device; and heat-curing the resin. A bottom end of a peripheral wall of the case is located above a bottom surface of the first metal. The bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member.

REFERENCES:
patent: 2003/0094682 (2003-05-01), Shinohara et al.

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