Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-05-13
2008-05-13
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S106000, C438S029000
Reexamination Certificate
active
07371593
ABSTRACT:
A method for manufacturing a semiconductor light emitting device can result in a device that includes a housing having a cavity, a light emitting element on a bottom face of the cavity, and a wavelength conversion layer provided within the cavity. The wavelength conversion layer can include particles of a wavelength conversion material. The method includes forming the wavelength conversion layer within the cavity, which can include applying and hardening a first material to form a first wavelength conversion layer on the light emitting element, and applying and hardening a second material to substantially fill the remainder of the entire cavity, thereby forming a second wavelength conversion layer. The semiconductor light emitting device manufactured by the inventive method can achieve uniform light emitting characteristics without substantially any uneven color and can include high heat dissipation efficiency.
REFERENCES:
patent: 6066861 (2000-05-01), Hohn et al.
patent: 6245259 (2001-06-01), Hohn et al.
patent: 6277301 (2001-08-01), Hohn et al.
patent: 6576930 (2003-06-01), Reeh et al.
patent: 6592780 (2003-07-01), Hohn et al.
patent: 6613247 (2003-09-01), Hohn et al.
patent: 6669866 (2003-12-01), Kummer et al.
patent: 6774401 (2004-08-01), Nakada et al.
patent: 6809342 (2004-10-01), Harada
patent: 6812500 (2004-11-01), Reeh et al.
patent: 7250715 (2007-07-01), Mueller et al.
patent: 2003/0214233 (2003-11-01), Takahashi et al.
patent: 2004/0159846 (2004-08-01), Doxsee et al.
patent: 2005/0224818 (2005-10-01), Harada
patent: 2006/0022582 (2006-02-01), Radkov
patent: 2006/0065906 (2006-03-01), Harada
patent: 2006/0138938 (2006-06-01), Tan et al.
patent: 10-190065 (1998-07-01), None
patent: 2001-127346 (2001-05-01), None
patent: 2001-196639 (2001-07-01), None
patent: 2001-210872 (2001-08-01), None
patent: 2001-345483 (2001-12-01), None
patent: 2004-056075 (2004-02-01), None
patent: 2004-111882 (2004-04-01), None
Cermak Kenealy & Vaidya LLP
Mulpuri Savitri
Stanley Electric Co. Ltd.
LandOfFree
Method for manufacturing semiconductor light emitting device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing semiconductor light emitting device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor light emitting device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2813043