Method for manufacturing semiconductor light-emitting device

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Mesa formation

Reexamination Certificate

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C438S042000, C372S046013

Reexamination Certificate

active

07871841

ABSTRACT:
A method of manufacturing a semiconductor light-emitting device includes steps of forming a vertical cavity structure including a layer to be oxidized on a semiconductor substrate, and then forming a circular groove having a depth which penetrates at least the layer to be oxidized from an upper surface of the vertical cavity structure, thereby forming a columnar mesa whose side face is surrounded by the groove, oxidizing the layer to be oxidized from the side face of the mesa, thereby forming a current confinement layer, and forming a mask layer covering at least a central region of the upper surface of the mesa and exposing at least an edge of the upper surface and the side face of the mesa to an external, and then etching at least the edge of the upper surface and the side face of the mesa by using the mask layer as a mask.

REFERENCES:
patent: 5719891 (1998-02-01), Jewell
patent: 5897329 (1999-04-01), Jewell
patent: 6014395 (2000-01-01), Jewell
patent: 6269109 (2001-07-01), Jewell
patent: 6320893 (2001-11-01), Ueki
patent: 6563137 (2003-05-01), Uchida
patent: 6639927 (2003-10-01), Sato et al.
patent: 6678307 (2004-01-01), Ezaki et al.
patent: 6765943 (2004-07-01), Jewell
patent: 6804279 (2004-10-01), Furukawa
patent: 6990128 (2006-01-01), Koyama et al.
patent: 7020173 (2006-03-01), Yamamoto et al.
patent: 7068696 (2006-06-01), Ezaki et al.
patent: 7244629 (2007-07-01), Ezaki et al.
patent: 7330494 (2008-02-01), Jewell
patent: 2001/0006528 (2001-07-01), Sato et al.
patent: 2001/0032984 (2001-10-01), Uchida
patent: 2002/0134987 (2002-09-01), Takaoka
patent: 2002/0141472 (2002-10-01), Koyama et al.
patent: 2002/0186735 (2002-12-01), Jewell
patent: 2003/0039294 (2003-02-01), Ueki et al.
patent: 2003/0063649 (2003-04-01), Ezaki et al.
patent: 2003/0169795 (2003-09-01), Otoma et al.
patent: 2004/0046180 (2004-03-01), Takaoka
patent: 2004/0066284 (2004-04-01), Hastings, Sr.
patent: 2004/0151221 (2004-08-01), Yamamoto et al.
patent: 2004/0165636 (2004-08-01), Ezaki et al.
patent: 2005/0013334 (2005-01-01), Watanabe et al.
patent: 2005/0092710 (2005-05-01), Biard et al.
patent: 2006/0056473 (2006-03-01), Tanigawa et al.
patent: 2006/0187997 (2006-08-01), Ezaki et al.
patent: 2007/0014324 (2007-01-01), Maeda et al.
patent: 2007/0153865 (2007-07-01), Maeda et al.
patent: 2008/0232414 (2008-09-01), Masui et al.
patent: 2008/0240194 (2008-10-01), Maeda et al.
patent: 2009/0032908 (2009-02-01), Masui et al.
patent: 2009/0052490 (2009-02-01), Maeda et al.
patent: 2009/0098675 (2009-04-01), Masui et al.
patent: 2009/0180506 (2009-07-01), Maeda et al.
patent: 2009/0310637 (2009-12-01), Kageyama et al.
patent: 2010/0040104 (2010-02-01), Maeda et al.
patent: 2010/0046565 (2010-02-01), Masui et al.
patent: 2003-158340 (2003-05-01), None
patent: 2004-179640 (2004-06-01), None

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