Method for manufacturing semiconductor laser package

Details Method for manufacturing semiconductor laser package Method for manufacturing semiconductor laser package

2005-05-10

2005-05-10

Vargot, Mathieu D. (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Optical article shaping or treating

Composite or multiple layer

C257S434000, C264S272170, C264S274000, C359S811000

Reexamination Certificate

active

06890459

ABSTRACT:
A method for manufacturing a semiconductor laser package in accordance with a preferred embodiment of the present invention includes the following steps: providing a housing (20) with a top portion (21), the top portion defining an optical cavity (23) composed of a window (231) and a sprue (232); disposing the housing in a cavity of a mold (not shown); closing the mold and injecting a melted transparent plastic resin into the sprue to fill the sprue and the window, thereby forming an integrated optical element; and taking the package out of the mold after curing of the injected plastic resin. The optical element is integrated with the housing, permitting light to pass therethrough. The package has a strong structure and is not as easily damaged when subjected to impacts. The optical element is made of a plastic material which is comparatively inexpensive. Therefore, the manufacturing cost is further reduced.

REFERENCES:
patent: 4217683 (1980-08-01), Cardinal
patent: 5838703 (1998-11-01), Lebby et al.
patent: 5939773 (1999-08-01), Jiang et al.
patent: 6614602 (2003-09-01), Huang

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