Method for manufacturing semiconductor laser element

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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C438S094000, C438S412000, C438S681000, C438S761000, C438S763000

Reexamination Certificate

active

07544535

ABSTRACT:
The method for manufacturing a semiconductor laser element according to the present invention has the steps of: forming a semiconductor laminated structure having an active layer composed of a semiconductor material containing Al; etching the semiconductor laminated structure to form a mesa; forming a first burying layer at a first growing temperature so as to coat the side of the mesa; and forming a second burying layer at a second growing temperature higher than the first growing temperature on the first burying layer to bury the circumference of the mesa.

REFERENCES:
patent: 6821801 (2004-11-01), Sato et al.
patent: 2003/0062517 (2003-04-01), Ryder et al.
patent: 5-136526 (1993-06-01), None
patent: 8-148752 (1996-06-01), None
patent: 2001-94212 (2001-04-01), None
patent: 2002-368339 (2002-12-01), None
patent: 2002-368339 (2002-12-01), None
S. Gouraud, et al., “High Speed AlGaInAs Multiple-Quantum-Well Electroabsorption Modulator Buried and Planarized with Semi-insulating Fe-Doped InP grown by Chloride assisted LP-MOVPE”, Proceedings, 17thInt. Conf. on IPRM, May 2005, 4 pages.

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