Method for manufacturing semiconductor laser device

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

Reexamination Certificate

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Details

C438S041000, C438S060000, C438S075000, C438S694000, C438S745000

Reexamination Certificate

active

10689629

ABSTRACT:
Disclosed is a method for manufacturing a semiconductor laser device, comprising the steps of: (a) forming a first conductive-type clad layer, an active layer, and a second conductive-type clad layer on a first conductive-type semiconductor substrate; (b) forming a ridge structure by selectively etching the second conductive-type clad layer; (c) forming a current blocking layer around the ridge structure, the current blocking layer having protrusions on the upper surface thereof adjacent to the ridge structure, and an amorphous and/or polycrystalline layer on a partial area thereof; and (d) removing at least the amorphous and/or polycrystalline layer from the current blocking layer, and wet-etching the upper surface of the current blocking layer so that the protrusions are reduced in size.

REFERENCES:
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patent: 5478775 (1995-12-01), Fujii
patent: 6924162 (2005-08-01), Watanabe et al.
patent: 6955994 (2005-10-01), Watanabe et al.
patent: 01-232784 (1989-09-01), None
patent: 02-260485 (1990-10-01), None
patent: 04-82291 (1992-03-01), None
patent: 06-69599 (1994-03-01), None
patent: 2002-198616 (2002-07-01), None
patent: 2002-246684 (2002-08-01), None
patent: 2003-010083 (2003-02-01), None
Japanese Patent Office Office Action mailed May 23, 2006.

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