Method for manufacturing semiconductor electronics devices

Details Method for manufacturing semiconductor electronics devices Method for manufacturing semiconductor electronics devices

2006-06-20

2006-06-20

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S744000, C438S785000

Reexamination Certificate

active

07064075

ABSTRACT:
A method is described for manufacturing electronic semiconductor devices comprising the steps of depositing in sequence a layer of hydrophobic material and a “deep UV” photo-resist layer on a semiconductor substrate, selectively removing the “deep UV” photo-resist layer and hydrophobic material in order to expose definite portions of the semiconductor substrate and etch the exposed portions by means of an watery acid solution. This method allows semiconductor devices to be manufactured, also having very critical sizes and with a convenient resolution and control of circuit patterns formed thereon through etching with watery acid solutions.

REFERENCES:
patent: 6004843 (1999-12-01), Huang
patent: 6121123 (2000-09-01), Lyons et al.
patent: 6251774 (2001-06-01), Harada et al.
patent: 6342448 (2002-01-01), Lin et al.
patent: 2004/0041272 (2004-03-01), Signorini
patent: 2005/0110152 (2005-05-01), Wang et al.

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