Method for manufacturing semiconductor devices using heat-treatm

Details Method for manufacturing semiconductor devices using heat-treatm Method for manufacturing semiconductor devices using heat-treatm

1992-10-22

1995-02-07

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

29 2501, 437982, H01L 21469

Patent

active

053875575

ABSTRACT:
A wafer(s) for producing semiconductor devices is subjected to heat treatment in a vertical thermal reactor, which is provided with an electric heating means setting a first temperature and another electric heating means setting a second temperature higher than the first temperature. The wafer(s) is moved upwards and is subected to a treatment in the second region of the vertical thermal reactor; and, is reverted to the first region. Rapid thermal processing of 6 or 8 inch wafer(s) is possbile without causing slip lines.

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J. Appl. Phys., vol. 63, No. 8, 15 Apr. 1988, R60, R99-104.

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