Method for manufacturing semiconductor devices

Details Method for manufacturing semiconductor devices Method for manufacturing semiconductor devices

1976-06-01

1978-08-29

Lowe, James B.

Metal working

Method of mechanical manufacture

Assembling or joining

29576S, 264272, B29C 600, H01L 2158, H01L 2160

Patent

active

041093739

ABSTRACT:
Disclosed is a method for fabricating semiconductor devices and apparatus that can be used in the practice thereof. A plurality of sets of lead wires is mounted on a reusable primary lead frame. While the lead frame, and thus the lead wires are supported, a pellet is attached to one wire of each of the sets and appropriate flying leads are bonded in place. The sets of lead wires are then transferred to a reusable segmented lead frame, that includes a plurality of elements which are resiliently mounted with respect to each other. Each element supports one set of lead wires. A plurality of cup-shaped mold cavities defined by the mold are filled with a curable fluid encapsulant. The mold is adapted to cooperate with the segmented lead frame as hereinafter set forth. The ends of the lead wires supporting the pellets are immersed in the encapsulant. Alignment pins on the segmented lead frame mate with the alignment openings in the mold, thus insuring proper alignment of the sets of lead wires and the cup-shaped mold cavities.

REFERENCES:
patent: 2492415 (1949-12-01), Coates et al.
patent: 3439238 (1969-04-01), Birchler et al.
patent: 3571920 (1971-03-01), Berg
patent: 3618199 (1971-11-01), King et al.

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