method for manufacturing semiconductor devices

Details method for manufacturing semiconductor devices method for manufacturing semiconductor devices

1989-04-06

1992-03-03

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437207, 437219, 26427217, 361421, 174 522, H01L 2302, B29C 1300

Patent

active

050932810

ABSTRACT:
In a method for manufacturing semiconductor devices, to a case main body are bonded leads each having an inner end on the inner side of a side edge of the case main body and an outer end on the outer side of the side edge. A semiconductor chip is electrically connected to the inner ends of the leads on the case main body. Subsequently, a lid is adhesively bonded to the case main body. Accordingly, it is possible to reduce the total time period required to manufacture each semiconductor device and to enhance the reliability and yield of semiconductor devices.

REFERENCES:
patent: 3686541 (1972-08-01), Livezey et al.
patent: 3706840 (1972-12-01), Moyle et al.
patent: 3740618 (1973-06-01), Vogel
patent: 3793474 (1974-02-01), Dunn et al.
patent: 3992617 (1976-11-01), Rice
patent: 4298883 (1981-11-01), Komatsu et al.
patent: 4326214 (1982-04-01), Trueblood
patent: 4523371 (1985-06-01), Wakashima
patent: 4552267 (1985-11-01), Layher
patent: 4701999 (1987-10-01), Palmer
patent: 4741787 (1988-05-01), Shimizu et al.
Modern Microelectronic Circuit Design, vol. I and II, Fogiel, ed., Research and Education Association, NY, N.Y., 1981, pp. 657-671.

Affiliated with

Also associated with

Rating

method for manufacturing semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with method for manufacturing semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and method for manufacturing semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-272030