Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-12-20
2005-12-20
Mayes, Melvin (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S248000, C156S249000, C156S250000, C156S256000, C438S068000, C438S119000, C438S464000
Reexamination Certificate
active
06977024
ABSTRACT:
A semiconductor device, which is obtained by sticking an adhesive sheet1comprising a base material2,an adhesive agent layer3formed on the base material2and conductor bodies4buried in the adhesive agent layer3to a semiconductor wafer, and removing the base material from the adhesive agent layer of the adhesive sheet1. The adhesive agent layer3and a substrate are then aligned and the semiconductor wafer and the substrate are adhered via the adhesive agent layer3to avoid defects caused by fluidity of an under filling material.
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Ebe Kazuyoshi
Yamazaki Osamu
LINTEC Corporation
Mayes Melvin
Posz Law Group , PLC
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