Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-09-18
2009-08-04
Smoot, Stephen W (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S126000, C257SE21503
Reexamination Certificate
active
07569419
ABSTRACT:
The present invention provides a method for manufacturing a semiconductor device, which is capable of suppressing an overflow of a sealing resin and obtaining good sealing quality, simply and at low cost. Further, the present invention provides a semiconductor device that suppresses an overflow of a sealing resin and has good sealing quality, simply and at low cost. Liquid first underfill higher in viscosity than liquid second underfill is charged into space defined between a corresponding edge side of four edge sides of each of semiconductor chips, at which the distance between at least one edge side and each of pads opposite thereto, of an interposer is of the shortest, and the interposer. The liquid first underfill is cured and sealed with first underfill. Thereafter, the liquid second underfill is charged into space defined between the semiconductor chip and the interposer excluding the space sealed with the first underfill. The liquid second underfill is cured and sealed with second underfill.
REFERENCES:
patent: 5290197 (1994-03-01), Ohnuma et al.
patent: 6373142 (2002-04-01), Hoang
patent: 6528408 (2003-03-01), Kinsman
patent: 2002/0100969 (2002-08-01), Farquhar et al.
patent: 2002/0185752 (2002-12-01), Ishikawa et al.
patent: 2003-234362 (2003-08-01), None
patent: 2004-179576 (2004-06-01), None
patent: 2005-276879 (2005-10-01), None
patent: 2006-140327 (2006-06-01), None
Oki Semiconductor Co., Ltd.
Rabin & Berdo P.C.
Smoot Stephen W
LandOfFree
Method for manufacturing semiconductor device that includes... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing semiconductor device that includes..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor device that includes... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4083613