Method for manufacturing semiconductor device, semiconductor...

Details Method for manufacturing semiconductor device, semiconductor... Method for manufacturing semiconductor device, semiconductor...

2008-11-21

2011-11-01

Smith, Bradley K (Department: 2894)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S166000

Reexamination Certificate

active

08048771

ABSTRACT:
A non-single-crystal semiconductor layer is formed over a substrate, and then a single crystal semiconductor layer is formed over part of the non-single-crystal semiconductor layer. Thus, a semiconductor element of a region which requires a large area (e.g. a pixel region in a display device) can be formed using the non-single-crystal semiconductor layer, and a semiconductor element of a region which requires high speed operation (e.g. a driver circuit region in a display device) can be formed using the single crystal semiconductor layer.

REFERENCES:
patent: 5744824 (1998-04-01), Kousai et al.
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6306694 (2001-10-01), Yamazaki et al.
patent: 6818529 (2004-11-01), Bachrach et al.
patent: 7317438 (2008-01-01), Yamazaki et al.
patent: 7508034 (2009-03-01), Takafuji et al.
patent: 2004/0183133 (2004-09-01), Takafuji et al.
patent: 2004/0219723 (2004-11-01), Peng et al.
patent: 2005/0173761 (2005-08-01), Takafuji et al.
patent: 2008/0245406 (2008-10-01), Yamazaki et al.
patent: 2008/0246109 (2008-10-01), Ohnuma et al.
patent: 2008/0280424 (2008-11-01), Yamazaki et al.
patent: 2008/0308810 (2008-12-01), Akimoto
patent: 08-006053 (1996-01-01), None
patent: 10-125929 (1998-05-01), None
patent: 10-125931 (1998-05-01), None
patent: 2004-134675 (2004-04-01), None
patent: 2005-539259 (2005-12-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing semiconductor device, semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing semiconductor device, semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor device, semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4259213