Method for manufacturing semiconductor device packages

Details Method for manufacturing semiconductor device packages Method for manufacturing semiconductor device packages

2006-08-01

2006-08-01

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S111000, C438S112000, C438S123000, C438S124000, C438S127000

Reexamination Certificate

active

07084003

ABSTRACT:
A method for encapsulating an electronic device is provided. The electronic device includes an integrated circuit, a lead frame for supporting the integrated circuit and having peripheral leads integrally formed therewith, and a heat sink thermally coupled to the lead frame. The heat sink includes an extension extending therefrom in a direction towards a corner of the electronic device. The method includes positioning the electronic device within a mold that includes a gate therein that is adjacent to and parallel with the extension. Molten insulative material is injected through the gate and into the mold for encapsulating the integrated circuit, and at least a portion of the lead frame and the heat sink.

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